The strip and etch process includes a solution, a mixture of solutions, or a mixture of gases that attacks the surfaces of a film or wafer substrate, removing material either selectively or non-selectively.

The etch process has three main purposes:
  • Removing thin metal films deposited on silicon wafers
  • Remove contaminants and particulates after grinding or lapping processes
  • Reduce stress after grinding or lapping processes
Auto Strip & Etch Deck
Auto Strip & Etch Deck
  • Removable films include but are not limited to

    Cu, Ti, Fe, V, TiN, Cr, Al, Ta, SiO, Ti, Zr