Lapping is a mechanical process in which a pad is used with polishing liquid to to remove excess silicon from a wafer substrate, often producing a dull grey, semi-reflective finish. Lapping reduces stress which can build up during the ingot slicing process, while also helping to remove defects on the wafer front and back sides. Pure Wafer maintains both single and double side lapping tools allowing for tailor made services depending on customer needs.

  • Single Side Lap Removal

    10 - 30µm

  • Double Side Lap Removal

    50 - 60µm

  • Special Double Side Lap Removal

    Up to 100µm