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Photo Resist for Lithography and Blanket Coatings​

Photo Resist

Noel’s broad range of blanket coatings & Lithography resist options are available for specific application requirements:

  • Semiconductor
  • Bio-Medical & Life Sciences
  • MEMS

All of these applications have various feature sizes and resolution requirements that determine the type of resist, thickness of the resist, any etch requirements, and lift-off of non-etch-able metals.

  • 1um I Line for small features 500nm
  • 10um I Line for larger features, deep etches
  • Lift-Off Resist
  • BiLayer Lift-Off Resist
  • 3um Plating Resist that can define 1um features, plate 3-5um high features
  • 20um Plating Resist that can define >10um features, plate 15um-20um high features
  • 50um SU-8 for mold applications
ResistNominal Thickness RangeWavelengthTypeStandard EBR
TARF-P61111500A to 2000A193nmBlanket Coat Only
TARF-P70527000A193nmBlanket Coat Only
TARF-Pi6-144800A193nmBlanket Coat Only
AR 3GSF-600600A to 800A248nm DUVAnti-Reflective CoatBlanket Coating Only
UV 210GS-0.62um248nm DUVPositive ToneBlanket Coating Only
UV 6-0.87000A248nm DUVPositive ToneBlanket Coating Only
AZ 125nXT-10A35um-60um365nm I LineNegative tone, Plating ResistLithography & Blanket Coating
AZ 125nXT-7A5um-20um365nm I LineNegative tone, Plating ResistLithography & Blanket Coating
AZ 12XT-20PL-055um to 10um365nm I LinePositive ToneLithography & Blanket Coating
AZ nLoF 20202.5um365nm I LineNegative Tone, Lift-OffLithography & Blanket Coating
AZ nLoF 20355um365nm I LineNegative Tone, Lift-OffLithography & Blanket Coating
HD 40022um365nm I LineNegative Tone, Photo-DefinableLithography & Blanket Coating
LOR 20A2um365nm I LineBi-LayerLithography & Blanket Coating
SPR 220-3.03.5um to 5um365nm I LinePositive ToneLithography & Blanket Coating
SPR 220-7.05um to 10um365nm I LinePositive ToneLithography & Blanket Coating
SPR 30122.5um to 3.8um365nm I LinePositive ToneLithography & Blanket Coating
SPR 955CM-0.71um365nm I LinePositive ToneLithography & Blanket Coating
SU-8 20021um to 2.5um365nm I LineNegative ToneLithography & Blanket Coating
SU-8 20052um to 5um365nm I LineNegative ToneLithography & Blanket Coating
SU-8 20105um to 10um365nm I LineNegative ToneLithography & Blanket Coating
SU-8 201510um to 25um365nm I LineNegative ToneLithography & Blanket Coating
SU-8 202525um to 50um365nm I LineNegative ToneLithography & Blanket Coating
SU-8 303550um to 75um365nm I LineNegative ToneLithography & Blanket Coating
Note:
  1. Contact Noel for specific thickness requirements, bake conditions, EBR.
  2. Noel validates the resist thickness via optical metrology to confirm the mean thickness range on silicon substrates on resist thickness <10um. On resist that is >10um a step height measurement is taken on silicon substrates.
  3. For Lithography applications contact Noel for specific bake requirements, any subsequent etch requirements.
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